Product Description

Common Packaging Types:

• IC Packaging (QFN, BGA, SOP, Flip-Chip)

• PCB Enclosures (Plastic, Metal, or Composite Housings)

• System-Level Packaging (Rack Mounts, Industrial Casings)

Materials Used:

• Plastics (ABS, Polycarbonate)

• Metals (Aluminum, Steel)

• Ceramics (High-Temperature Applications)

• Composites (Lightweight & Durable)

Applications:

• Consumer Electronics (Smartphones, Laptops)

• Automotive (ECUs, Sensors)

• Medical Devices (Implantable & Diagnostic Equipment)

• Aerospace & Defense (Avionics, Ruggedized Systems)

Effective electronics packaging balances cost, performance, and manufacturability while meeting industry standards (IPC, JEDEC, MIL-SPEC).